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Samsung Electronics has opted to exclusively use fan-out wafer level packaging (FOWLP) technology for the high-spec Exynos processors in its Galaxy S series while sticking with traditional packaging methods for lower-end products like the Galaxy A.
This move aims to enhance heat dissipation performance and improve overall efficiency. The upcoming Galaxy S25 series will feature the new Exynos 2500 chipset, utilizing FOWLP technology to mount semiconductors directly on a wafer, eliminating the need for a printed circuit board (PCB). This innovative packaging method increases the exposed area for heat dissipation while reducing thickness.
Although FOWLP is costlier compared to existing methods, it ensures superior electrical characteristics and is deemed crucial for premium devices. While mid-priced phones like the Galaxy A will continue to use the existing packaging method due to cost considerations, Samsung’s System LSI Division may explore increasing the proportion of Exynos processors in premium phones in the future, leveraging its expertise in heat dissipation.
With the upcoming Exynos 2500 featuring more advanced microprocessing and utilizing a second-generation 3-nano process (SF3), Samsung aims to enhance speed and power efficiency, marking a significant improvement over its predecessors.